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Latest in Laser Cutting Machines

Hybrid Hole Drilling Machine
Product August 31, 2016
Hybrid Hole Drilling Machine
Synova and Makino are joining forces to offer the HybridCell, which combines the power of Synova's Laser MicroJet (LMJ) with Makino's leading edge EDM capabilities. It is a fully automated, manufacturing-ready, work cell that can handle a wide range of hole-drilling applications. The HybridCell consist of a MCS 500 cutting system, along with Makino's EDBV EDM hole-drilling machine.
Zinc Selenide and Zinc Sulfide Optics
Product July 13, 2016
Zinc Selenide and Zinc Sulfide Optics
Zinc Selenide (ZnSe) and Zinc Sulfide (ZnS) optics that are manufactured to specification for FLIR, surveillance, military, and medical applications are available from Laser Research Optics. Laser Research ZnSe and ZnS Optics are custom manufactured to ISO-10110 specifications in sizes from 0.5" to 5" OD and can be coated to achieve specific wavelengths from 7 to 11 µm for ZnSe and 400 nm to 12 µm for ZnS.
SpeedMarker 700 Galvo Laser Marking Station
Product July 1, 2016
SpeedMarker 700 Galvo Laser Marking Station
The SpeedMarker 700 from Trotec Laser Inc. is a compact galvo laser marking station. The SpeedMarker series was designed for efficient industrial laser marking of metals and plastics.
Laser Systems L2000
Product June 15, 2016
Laser Systems L2000
The Marubeni Citizen-Cincom Laser Systems L2000 provides the capability of combining conventional machining and laser cutting on a single machine platform, reducing part handling and ensuring improved part accuracies.
Arnold Ravensburg Laser Technology
Product June 14, 2016
Arnold Ravensburg Laser Technology
Available from German Machine Tools of America (GMTA) is the laser technology of Arnold Ravensburg, a leading supplier to the German gearmaking, automotive and off-highway powertrain markets. New machines are being offered by GMTA, along with full laser integration technology through application engineering.
Model LT8.10 Fiber Laser Tube Cutting System
Product June 14, 2016
Model LT8.10 Fiber Laser Tube Cutting System
BLM GROUP USA has announced the introduction of the Model LT8.10 fiber laser tube cutting system. The LT8.10 is a three dimensional, 3kW fiber laser tube cutting machine that provides flexibility and user-friendliness for precise laser cutting on a variety of materials for tube diameters up to 9.5 in.
DPSS Laser Marking System
Product May 24, 2016
DPSS Laser Marking System
LNA Laser Technology introduces a new laser marking system, Model MP2. The MP2, all-in-one DPSS laser marking system is ideal for applications that require high resolution and where high-speed throughput isn't required.
LabMax-Pro Mobile App
Product May 13, 2016
LabMax-Pro Mobile App
A new mobile app from Coherent Inc. enables operation of the company's laser power and energy sensors using a tablet computer, thus delivering an improved user interface and enhanced ease-of-use.
LT-FREE 5-axis Fiber Laser Machine
Product April 27, 2016
LT-FREE 5-axis Fiber Laser Machine
BLM GROUP USA has announced the introduction of the LT-FREE―a 5-axis, fiber laser machine for cutting 3D formed or shaped parts such as bent tubes, hydroformed tubes, welded assemblies and stamped or flat sheets. The part does not move during the cutting operation as the laser head's freedom of movement reportedly guarantees the highest flexibility and accuracy to produce parts.
TruLaser 2030 Fiber Laser
Product April 19, 2016
TruLaser 2030 Fiber Laser
TRUMPF's TruLaser 2030 fiber with new LiftMaster Shuttle is the ideal choice for fabricators looking for productivity and process reliability at competitive investment and operating costs. It is ideal for job shops running up to three shifts per day or for first-time laser users.
eX Plus Series Laser
Product March 31, 2016
eX Plus Series Laser
MC Machinery Systems Inc. announces its newest CO2 laser: the eX Plus series. The updated, offering expands on Mitsubishi's popular eX series and LVPlus II model. Improvements like its high-speed, heavy-duty motion system and more powerful piercing can reduce processing times by 50 percent when compared to previous generations.

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