C6025 Industrial PC

Beckhoff Automation has announced another addition to the popular family of ultracompact C60xx series Industrial PCs (IPCs) with the new C6025. This space-saving IPC delivers the high computing performance of the Intel Core i series in a fanless, small-form-factor device. The new Intel Core i U processors, with exceptionally low power requirements, have made this advancement possible.

Measuring just 82 x 127 x 40 mm and combining high computing performance with a fanless design, the Microsoft “Azure Certified” C6025 IPC is an ideal choice for demanding automation and IoT applications where green, sustainable IT is also a requirement. The Intel Core i U processors deliver Core i performance capabilities yet consume significantly less power than other processors of the same series. The 8th Gen Intel Core i U processors used in the C6025 also offer an advantage typical of evolving PC-based technology: higher performance at the same price point as previous offerings. With this new addition, the Beckhoff portfolio of industry-ready and long-term available IPCs now spans five CPU performance classes – from ARM through to Intel Xeon – for maximum hardware scalability.

The energy-efficient Intel Core i U processors in the IPC, in combination with an advanced cooling design, enable fully passive heat dissipation via a heat sink on one side. Housed in an aluminum and zinc die-cast enclosure, the C6025 feature set offers the following:

• up to four CPU cores
• 4 GB DDR4 RAM (expandable to 8 GB)
• 40 GB M.2 SSD with 3D flash memory
• 1 x DisplayPort video connector
• 4 x USB 3.0 ports
• on-board Ethernet controller with 3 x 100/1000Base-T ports
• operating temperature range of 0 to 50° C

The energy-efficient, ultra-compact C6025 IPC expands the broad PC-based control portfolio from Beckhoff to offer a performance level situated between the entry-level devices with Intel Atom CPUs and those with high-end Intel Core i-series processors. With this addition, the Beckhoff product portfolio better addresses the growing trend toward compact, fanless IPCs while supporting applications with highly intensive computing requirements.