Garnet laser platform

Electro Scientific Industries Inc. (ESI), Shanghai, China, recently introduced the Garnet adaptable laser micromachining platform for high-volume cutting, marking, drilling or engraving applications, according to a Feb. 16 company news release. The Garnet platform is said to compliment ESI’s current micromachining portfolio delivering lower cost of ownership—specifically to meet the need for larger format materials among manufacturers in China.

The Garnet platform is said to feature superior configuration flexibility, compound beam motion control and high levels of precision—all while lowering overall cost of ownership with a 25 percent jump in placement accuracy compared to other mid-range laser systems, the company reported.

The Garnet platform’s 300mm x 300mm stage is designed to allow manufacturers working with large-format materials to optimize production and service for a wider range of customer needs. To meet the market’s wide range of application needs, the Garnet platform is built on a versatile base frame capable of multiple laser engine and optics combinations, and it can be configured and delivered rapidly to meet the short product ramp times of contract manufacturers in China.

"Manufactures of larger format components in consumer electronics, automotive and soft goods markets have the same range of application needs and pressures to lower their cost of ownership as those manufacturing smaller components in the consumer electronics market," said Mantreh Nournia, general manager of ESI's micromachining division. "To meet these market needs and increase manufacturer’s capabilities on large-format materials, we launched the Garnet platform as the third system in our micromachining series and ESI’s second system built on a low-cost China platform."

The Garnet platform is positioned between the Lumen platform, which is said to be ideal for high-end prototyping and production applications where precision and flexibility are paramount, and the Jade platform, a lower-cost system introduced earlier this year for less demanding general purpose laser machining applications.