Signature Analysis Feature
Signature analysis allows monitoring these cutting processes where the material diameter changes consistently during a cut. The RPM varies as the material increases or decreases causing sensor fluctuations unrelated to the tooling. To monitor these cutting operations, the signature analysis software learns the entire path (signature) of a cut using any sensor type. The user will define boundaries around this signature, both above and below it. These boundaries define a window that the signature must stay within to satisfy a good cut.