Electro Scientific Industries Inc. announced the availability of its Geode laser-based micro-via drilling system for high-density interconnects (HDI) on rigid printed circuit boards (PCB). This new entry combines a CO2 laser and advanced beam control capabilities to deliver industry-leading throughput and accuracy from a system that is…

Garnet laser platform

Electro Scientific Industries Inc. (ESI), Shanghai, China, recently introduced the Garnet adaptable laser micromachining platform for high-volume cutting, marking, drilling or engraving applications, according to a Feb. 16 company news release. The Garnet platform is said to compliment ESI’s current micromachining portfolio delivering lower cost…