EP21TDCN-LO Electrically Conductive Adhesive/Sealant
Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two-component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock.