Tungaloy has expanded its TetraMini-Cut, a 4-edged grooving insert line to include TCL18 inserts in 1.75 mm and 2.5 mm thicknesses.
TetraMini-Cut features a small grooving insert with four economical cutting edges. Its innovative insert clamping design ensures secure insert retention and high repeatability, promising machining accuracy and tool life predictability.
TCL18 is designed to ensure light cutting action as well as good chip control when fed at low feed rates.
This expansion includes two new TCL18 inserts with 1.75 mm and 2.5 mm thicknesses, expanding the existing line of 1.5 mm, 2.0 mm, and 3.0 mm inserts. The inserts are available in grade AH7025, a nano-multilayer PVD coating with high-aluminum content that provides hardness and adhesion to the grade for better process security during grooving operations. Along with TCS18, TCG18, and TCP18 style inserts, the new TCL18 inserts provide an ideal solution for a vast array of grooving applications for general to miniature parts machining.
At a Glance
TCL18 ensures consistent chip formation at low feed rates
Available in AH7025
Suitable for various materials including alloy steel, stainless steel, and heat-resistant superalloys
Machining grooves and shallow channels. Example: grooving ball-bearing raceways. Typically performed by tools that are capable of light cuts at high feed rates. Imparts high-quality finish.
Hardness is a measure of the resistance of a material to surface indentation or abrasion. There is no absolute scale for hardness. In order to express hardness quantitatively, each type of test has its own scale, which defines hardness. Indentation hardness obtained through static methods is measured by Brinell, Rockwell, Vickers and Knoop tests. Hardness without indentation is measured by a dynamic method, known as the Scleroscope test.
Tool-coating process performed at low temperature (500° C), compared to chemical vapor deposition (1,000° C). Employs electric field to generate necessary heat for depositing coating on a tool’s surface. See CVD, chemical vapor deposition.
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