EP42HT-2LTE Curing Epoxy

Master Bond EP42HT-2LTE is often chosen for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat.

This system is notable for having a low coefficient of thermal expansion of 9-12 x 10^-6 in/in/°C. With a tensile lap shear strength of over 1,200 psi, it bonds well to a wide variety of similar and dissimilar substrates, including metals, composites, ceramics, glass and many plastics. EP42HT-2LTE features superior electrical insulation properties, chemical resistance and dimensional stability over the wide service temperature range of -60°F to +300°F. It also offers low linear (<0.01 percent) and volumetric (<0.1 percent) shrinkage upon curing, which is useful for potting and encapsulation applications.

Featuring a light cream color, EP42HT-2LTE is prepared using a non-critical 100 to 40 mix ratio by weight or a 100 to 50 mix ratio by volume. After mixing a 100 gram batch, its working life is 60-90 minute open time. This product is available in standard packaging with sizes ranging from ½ pint to 5 gallon kits.

Master Bond EP42HT-2LTE is high temperature resistant, two part epoxy with an ultra low thermal expansion coefficient. This dimensionally stable system also features low linear and volumetric shrinkage upon cure.