Medical

DX200 directly binds the diamond particles without using binder materials. This allows the grade to have an extremely pure cutting edge, making it an extremely effective tool for machining application-specific components that demand high levels of material purity, such as metal medical implants and sputtering targets for semiconductor applications.

The Z-Carb HPR portfolio is equipped with various lengths, reach, square, and corner radius styles, along with new chip breaker options to address different machining situations. These end mills are coated with Ti-NAMITE-M and Ti-NAMITE- A, ensuring superior performance even in difficult-to-machine materials like Titanium and Stainless Steel.

Diebold JetSleeve 2.0 technology offers a unique coolant supply system that is unmatched by any other tool holder product. The JetSleeve 2.0 patented design not only delivers coolant to the cutting edges of your cutting tools, but it also it accelerates the coolant multiple times over the “normal” machine coolant pressure to blast the chips/swarf away for the machined surfaces to eliminate recutting of chips that leads to shorter tool life and prevents smooth machined surfaces.

The ultrashort pulse laser marks in the deepest, matt and non-reflective black without generating significant heat input on the workpiece. Even through further processing steps, such as passivation, the marking remains reliably legible and corrosion resistant. Due to the very short pulses down to the femtosecond range, in combination with high pulse energies, the system marks various stainless steels, titanium and a variety of plastics.

The EM-30 product series (153 ball BGA) complies with e.MMC-5.1 specifications and is fully backward compatible. It is designed for an extended temperature range of -40°C to 85°C and is suitable for use in harsh environmental conditions. The S-56(u) SD and microSD memory cards attain sequential read and write data rates of 95 MB/s and 74 MB/s, respectively. The cards are optimized for high-performance applications with random read IOPS of 2,200 and random write IOPS of 1,300.

The goal of the program is to minimize machine downtime and the program’s process is simple. When a customer runs a machine until it fails, they can send in their damaged assembly for an engineering analysis to determine if Riten can refurbish/repair to “like new” condition−or build a complete new unit. Riten also encourages customers using the specials program to keep a complete spare assembly readily available in stock. The goal is to have one on hand at all times to avoid machine downtime during the rebuild process.